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根据外媒消息，2020年新的iPhone将会换用高通基带，全面取消现用的英特尔基带。今年上半年，苹果公司已经和高通和解并达成了合作协议。

据悉，2020年的iPhone产品将全面搭载高通最新的X55 5G基带，因此因基带造成的信号问题有望得到很大改善。

除基带外，频射天线也是影响手机信号接收能力强弱的重要因素。据外媒的爆料，2020年新的iPhone将天线升级为LCP软板。

升级的天线数量将大大提高，并且对净空区的要求也会降低。苹果将会为新的iPhone搭载三条LCP，并且支持毫米波高频频段，网速方面也会因此得到显著提升。

苹果将把2020年iPhone升级的重心，放到信号问题的解决上来，苹果也有足够的技术、资源和信心在明年发布会之前解决信号问题。这对果粉们来说无疑是个重磅的好消息。

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